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Debut of Flip Chip Bonding system that meets the needs of your production

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点击次数:922 更新时间:2017年11月20日15:49:44 打印此页 关闭

Standard

Pre heater table Bond heater table Auto nozzle cleaning Ultrasonic checking

Bump collapse height measurement Bump absence detection

Bad mark detection Wafer theta axis correction

Wafer expansion Hot blow

Nozzle surface monitoring LAN

Nozzle bonding counter Production management data


Option and Special Features

Magazine Loader/Unloader Hepa-filter

Ionizer

Profile monitor(US,Load,Bump height)

Chip tray supply

Map data(between bump bonder etc)

Bond nozzle heater

Substrate(package)special  clamp

Bond  inspection(Pre  ,  Post)

Bond nozzle polishing jig

Ultrasonic horn(For large chip)




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